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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- 한국과학기술원 정보전자연구소 IDEC Journal of Integrated Circuits and Systems IDEC Journal of Integrated Circuits and Systems Vol.4 No.4
- 발행연도
- 2018.10
- 수록면
- 15 - 20 (6page)
이용수
초록· 키워드
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In this paper, we designed a first-order discrete-time sigma-delta modulator to analyze the effects of ground noise coupling to audio circuits. The noise-coupling problem generally occurs in a time-division multiple access (TDMA) smartphone when its RF amplifier switch at 217 Hz to transmit signals for communication. We designed the modulator for operation at 3.3 V DC power and 6.144 MHz sampling frequency with 48 kHz baseband sampling frequency and 128 oversampling rate. With the designed modulator, we analyzed the output noise of the modulator when a sinusoidal ground noise with a 100 mV amplitude and 6 kHz frequency is applied to the ground node of the circuit. The modulator has shown a -50 dB 6 kHz noise power. Furthermore, we fabricated different designs of PCBs to mount the designed modulator and analyze the output noise of the modulator depending on PCB design. In the analysis, the amount of noise coupling reduced as the shared return current path between the modulator and a noise source on PCBs reduces.
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참고문헌 (19)
참고문헌 신청
P. Fornberg / 2002 / The impact of a nonideal return path on differential signal integrity / IEEE Trans. Electromag. Compat. 44:11~15
D. G. Kam / 2004 / Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission / IEEE Trans. Adv. Packag. 27(4):590~596
T. L. Wu / 2004 / A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures / IEEE Microw. Wireless Compon. Lett. 14(7):337~339
J. Kim / 2006 / Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards / IEEE Trans. Electromagn. Compat. 48(2):319~330
X. P. Wang / 2010 / Multiphysics characterization of transient electrothermomechanical responses of through-silicon via applied with a periodic voltage pulse / IEEE Trans. Electron Devices 57(6):1382~1389
D. G. Kam / 2004 / Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission / IEEE Trans. Adv. Packag. 27(4):590~596
T. L. Wu / 2004 / A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures / IEEE Microw. Wireless Compon. Lett. 14(7):337~339
J. Kim / 2006 / Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards / IEEE Trans. Electromagn. Compat. 48(2):319~330
X. P. Wang / 2010 / Multiphysics characterization of transient electrothermomechanical responses of through-silicon via applied with a periodic voltage pulse / IEEE Trans. Electron Devices 57(6):1382~1389
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